0444280606

3.00毫米（ 0.118 “ ）间距微飞度3.0 BMI ™接头，表面安装，双排，直角，无管理单元塑料栓锁电路板，电路6 ， 0.76μm （ 30μ ”），金（Au ）选择性电镀 3.00mm .118" Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76μm 30μ" Gold Au Selective Plating

Connector Header Through Hole, Right Angle 6 position 0.118" 3.00mm

得捷:
CONN HEADER R/A 6POS 3MM

艾睿:
Conn HDR 6 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI Tray

安富利:
Conn Wire to Board HDR 6 POS 3mm Solder RA Thru-Hole Tray