MC33265

MULTICOMP  MC33265  散热器, 方形, 电路板, 挤压, TO-218, TO-220, 3.9 °C/W, 38.1 mm, 41.6 mm, 25 mm

The is a vertical-mounting extruded Heat Sink designed for a single TO-218/TO-220 package.

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High power dissipation

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Notched base

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Solderable mounting pins

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Pre-drilled mounting holes

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Black anodize finish