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UFR100

1A ULTRAFAST RECOVERY DIODE

FEATURES

• PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE SOFT GLASS

• VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION

  Solder Voids: Typical < 2%, Max. < 10% of Die Area

• LOW SWITCHING NOISE

• LOW THERMAL RESISTANCE

• HIGH SWITCHING CAPABILITY

• LOW FORWARD VOLTAGE DROP


UFR100 PDF数据文档
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UFR100 Diotec Semiconductor