909-37-1-15-2-B-0

Heatsink; Eliptical Pin with clip assembly; 37 x 14.6mm

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEAT SINK ELLIP FIN 37X37MM CLIP

Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 37 x 14.6 mm

909-37-1-15-2-B-0详细参数

909-37-1-15-2-B-0 PDF数据文档

图片	型号	厂商	下载
	909-37-1-15-2-B-0	Wakefield Engineering
	909-235R BK	Bivar
	909-235R NT	Bivar
	909-2131-1	Bluetechnix
	909-2145-1	Bluetechnix
	909-235 BK	Bivar
	909-235 NT	Bivar
	909-06	PanaVise Products
	909-10M NC032	Alpha Wire
	909-37.5-2-12-2-B-0	Wakefield Engineering
	909-37.5-2-23-2-B-0	Wakefield Engineering