907-33-2-23-2-B-0

Heatsink; Fin Pin with clip assembly; 33 x 22.6mm

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEAT SINK PIN FIN 33X33MM CLIP

Allied Electronics:
Heatsink; Fin Pin with clip assembly; 33 x 22.6 mm

907-33-2-23-2-B-0详细参数

907-33-2-23-2-B-0 PDF数据文档

图片	型号	厂商	下载
	907-33-2-23-2-B-0	Wakefield Engineering
	907-0030	Duratool
	907-33-1-18-2-B-0	Wakefield Engineering
	907-33-2-18-2-B-0	Wakefield Engineering
	907-33-2-21-2-B-0	Wakefield Engineering
	907-33-1-21-2-B-0	Wakefield Engineering
	907-33-2-15-2-B-0	Wakefield Engineering
	907-33-1-33-2-B-0	Wakefield Engineering
	907-BK	Anderson Power Products 安德森电源
	907-040	Bivar
	907-105	Bivar