CCI09

CCI  CCI09  散热器, BGA, FPGA, 双面胶, BGA, 9.96 °C/W, 6 mm, 30 mm, 30 mm

The 09 is a 9 x 30 x 30mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.

e络盟:
CCI  CCI09  散热器, BGA, FPGA, 双面胶, BGA, 9.96 °C/W, 6 mm, 30 mm, 30 mm

Newark:
# CCI  CCI09  Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.96 C/W, 6 mm, 30 mm, 30 mm