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BGT60E6327XTSA1

RF Transceiver QPSK/QAM 3.3V 119Pin WFWLB T/R

Summary of Features:

 

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Developed for telecommunication only
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Support FDD and TDD systems in full duplex or half-duplex mode
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Support modulation schemes: QPSK, QAM
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Support small cell backhaul up to 1000m
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Direct conversion I/Q transceiver
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IF bandwidth 1000MHz
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Differential RF/IF interface for lower loss and better isolation
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Integration of VCO Voltage Controller Oscillator signal generation
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PNssb Phase Noise single side band < -80dBc/Hz @ 100kHz offset
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Typ. 13dBm linear output power
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7dB NF Noise Figure
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Integrated power detection function
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Integrated thermal sensor
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eWLB embedded Wafer Level Ball Grid Array packaged device

Benefits:

 

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Packaged solution, easy to use and standard SMT flow for mounting on customer system
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Highly integrated RF transceiver requiring no external RF discretes, thereby simplifying the customer design and time-to-market
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Architecture of Direct Conversion Zero IF eases interface to latest modem/BB designs no external filter
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A transceiver approach with implemented BIST B uilt-I n S elf-T est on the chip to enable RF testing at production
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Family concept common architecture, package, pinning simplifies customer designs due to modular approach

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BGT60E6327XTSA1 Infineon 英飞凌