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637-20ABP

WAKEFIELD SOLUTIONS  637-20ABP  散热器, 方形, 黑色阳极氧化, 波焊, TO-220, 9.17 °C/W, 50.8 mm, 34.9 mm, 12.7 mm

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. 15.9. Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.


得捷:
HEATSINK TO-220 VERT MT BLK 2"


贸泽:
Heat Sinks TO-220 VERT MT 2"


e络盟:
散热器, 方形, 黑色阳极氧化, 波焊, 9.17 °C/W, TO-220, 34.9 mm, 50.8 mm, 12.7 mm


Allied Electronics:
Heatsink; Vertical Mount; 2 in.; 55C @ 6W; 4.7C/W; Non-RoHS


Newark:
The 637-20ABP is a 50.8 x 34.9 x 12.7mm high-efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave-solderable pins on 1-inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized.


AMEYA360:
HEATSINK TO-220 VERT MT BLK 2"


Electro Sonic:
Heat Sink Passive TO-220 Solderable Wave Aluminum 4.7 °C/W Black Anodized


637-20ABP PDF数据文档
图片 型号 厂商 下载
637-20ABP Wakefield Engineering
637-15ABP Wakefield Engineering
637-10ABP Wakefield Engineering
637-W15-221-012 EDAC 亚得
637-15ABEP Wakefield Engineering
637-026-230-042 EDAC 亚得
637-015-230-046 EDAC 亚得
637-026-230-041 EDAC 亚得
637-026-230-046 EDAC 亚得
637-W15-222-012 EDAC 亚得
637-10ABPE Wakefield Engineering