511-12U

散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm

散热片 电源模块 铝 - 顶部安装，挤制

得捷:
HEATSINK FOR PWR MOD/IGBT/RELAY

贸泽:
散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm

Verical:
Heat Sink Passive 0.045C/W

MASTER:
Heat Sink Passive 0.045°C/W

Online Components:
Heat Sink Passive 0.045°C/W

Electro Sonic:
Heat Sink Passive 0.045°C/W