SN74LVT16952
具有三态输出的 3.3V ABT 16 位寄存收发器
The "LVT16952 are 16-bit registered transceivers designed for low-voltage 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock CLKAB or CLKBA input provided that the clock-enable or input is low. Taking the output-enable or input low accesses the data on either port.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The is available in "s shrink small-outline DL and thin shrink small-outline DGG packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.
The SN54LVT16952 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16952 is characterized for operation from -40°C to 85°C.
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- State-of-the-Art Advanced BiCMOS Technology ABT Design for 3.3-V Operation and Low-Static Power Dissipation
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- Members of the Texas Instruments WidebusTM Family
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- Support Mixed-Mode Signal Operation 5-V Input and Output Voltages With 3.3-V VCC
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- Support Unregulated Battery Operation Down to 2.7 V
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- Typical VOLP Output Ground Bounce < 0.8 V at VCC = 3.3 V, TA = 25°C
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- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model C = 200 pF, R = 0
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- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
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- Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
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- Support Live Insertion
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- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
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- Flow-Through Architecture Optimizes PCB Layout
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- Package Options Include Plastic 300-mil Shrink Small-Outline DL and Thin Shrink Small-Outline DGG Packages and 380-mil Fine-Pitch Ceramic Flat WD Package Using 25-mil Center-to-Center Spacings
Widebus is a trademark of Texas Instruments Incorporated.