630-45AB

630 系列 35 x 35 x 11.4 mm 黑色阳极氧化 全方向 散热片

The 630 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks DVD and global positioning systems GPS.

得捷:
HEATSINK FOR BGAS FIN HGT .45"

Allied Electronics:
Heatsink; Omnidirectional; 11.4mm; Black Anodized

富昌:
630 系列 35 x 35 x 11.4 mm 黑色阳极氧化 全方向 散热片

Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized

Verical:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized

Newark:
# WAKEFIELD SOLUTIONS  630-45AB  Heat Sink, Square, For Ball Grid Arrays, Penguin Cooler, Pin Fin Clip-On, BGA, 11.4 mm, 35 mm

MASTER:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized