2317857-2

防尘盖/罩, 防尘&EMI;盖, AMP OSFP I/O连接器, 锌合金主体

TE"s octal small form-factor pluggable OSFP I/O connectors support aggregatedata rates up to 200 Gbps 8 x 28G NRZ and 400 Gbps 8 x 56G PAM-4, with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps

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Applications: Servers, Switches, Storage Devices, Routers etc.