660-29AB

WAKEFIELD SOLUTIONS  660-29AB  散热器, 38.9MMX7.2MM

散热片 BGA 铝 2.0W @ 30°C 顶部安装

得捷:
HEATSINK EXTRUSION 37MM

e络盟:
散热器, 38.9MMX7.2MM

Allied Electronics:
Unidirectional Fin Heat Sink for 37mm BGA

Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Verical:
Heat Sink Passive BGA Pin Array Black Anodized

Newark:
# WAKEFIELD SOLUTIONS  660-29AB  Heat Sink, For Ball Grid Array, BGA, 7.2 mm, 38.9 mm, 38.9 mm

MASTER:
Heat Sink Passive BGA Pin Array Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Black Anodized