RE210-S2

ROTH ELEKTRONIK  RE210-S2  电路板, 原型, 环氧玻璃复合, 1.5mm, 100mm x 220mm

The is a 100 x 220mm dual inline Prototyping Board, made of 1.5mm fibreglass CEM3 and 35µm Cu single-sided construction. This hot air levelling prototyping board comes with 2.2 x 2.2mm soldering pads 38 x 85.

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1mm Hole diameter

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2.54 x 2.54mm Hole spacing

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Lead-free hot air levelling