LA363B5CB
金属外壳，机箱面板上半导体 METAL CASE, CASE-MOUNTED SEMICONDUCTORS
Heat Sink TO-3 Aluminum
得捷:
HEATSINK PWR 1.25"H BLACK TO-3
AMEYA360:
HEATSINK PWR 1.25"H BLACK TO-3
金属外壳，机箱面板上半导体 METAL CASE, CASE-MOUNTED SEMICONDUCTORS
Heat Sink TO-3 Aluminum
得捷:
HEATSINK PWR 1.25"H BLACK TO-3
AMEYA360:
HEATSINK PWR 1.25"H BLACK TO-3
