BP100-0.005-00-6/6

BERGQUIST  BP100-0.005-00-6/6  热绝缘, Bond-Ply 100, .005", 6" x 6"板, 碳, 0.8 W/m.K, 3000 V, 0.127 mm, 100000000000 ohm-m

* Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB

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Thermal impedance: 0.86°C - in²/W @ 100 psi

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High bond strength to a variety of surfaces

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Double-sided pressure sensitive adhesive tape

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High performance, thermally conductive acrylic adhesive

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Can be used instead of heat cure adhesive, screw mounting or clip mounting