0877971800

2.54毫米（ .100 ）间距C- Grid®头，通孔，双排双机身，垂直， 18电路，金（Au ）闪镀， 9.35毫米（ 0.368 ）堆码高度，托盘包装 2.54mm .100 Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold Au Flash Plating, 9.35mm .368 Stacking Height, Tray Packaging

18 Position Header Spacer Connector 0.100" 2.54mm Gold Through Hole

得捷:
CONN HDR 18POS 0.1 STACK T/H