ISD1790SYIR
数据手册.pdf180s Voice Record and Playback 160KΩ 2.5V/3.3V/5V 28Pin SOIC
GENERAL DESCRIPTION
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi
message voice record and playback device ideally suited to a variety of electronic systems. The
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
specific device.
FEATURES
Integrated message management systems for single-chip, push-button applications
o REC:level-trigger for recording
o PLAY:edge-trigger for individual message or level-trigger for looping playback sequentially
o ERASE:edge-triggered erase for first or last message or level-triggered erase for all messages
o FWD:edge-trigger to advance to the next message or fast message scan during the playback
o VOL: 8 levels output volume control
o INT RDY : ready or busy status indication
o RESET: return to the default state
o Automatic power-down after each operation cycle
Message and operation indicators
o Four customizable Sound Effects SEs for audible indication
o Optional vAlert voiceAlert to indicate the presence of new messages
o LED: stay on during recording, blink during playback, forward and erase operations
Dual operating modes
o Standalone mode:
Integrated message management techniques
Automatic power-down after each operation cycle
o SPI mode:
Fully user selectable and controllable options via APC register and various SPI commands
Two individual input channels
o MIC+/MIC-: differential microphone inputs with AGC Automatic Gain Control
o AnaIn: single-ended auxiliary analog input for recording or feed-through
Dual output channels
o Differential PWM Class D speaker outputs directly drives an 8 Ωspeaker or a typical buzzer
o Configurable AUD current or AUX voltage single-ended output drives external audio amplifier
ChipCorder standard features
o High-quality, natural voice and audio reproduction
o 2.4V to 5.5V operating voltage
o 100-year message retention typical
o 100,000 record cycles typical
Temperature options:
o Commercial: 0°C to +50°C die; 0°C to +70°C packaged units
o Industrial: -40°C to +85°C packaged units
Packaging types: available in die, PDIP, SOIC and TSOP
Package option: Lead-free packaged units