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CC430F5133IRGZR

CC430F5133IRGZR

TI(德州仪器) 电子元器件分类

MSP430 SoC的射频核心 MSP430 SoC with RF Core

The Texas Instruments CC430 family of ultralow-power microcontroller system-on-chip SoC with integrated RF transceiver cores consists of several devices featuring different sets of peripherals targeted for a wide range of applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features the powerful MSP430 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.

The CC430 family provides a tight integration between the microcontroller core, its peripherals, software, and the RF transceiver, making these true SoC solutions easy to use as well as improving performance.

The CC430F61xx series are microcontroller SoC configurations that combine the excellent performance of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32KB of in-system programmable flash memory, up to 4KB of RAM, two 16-bit timers, a high-performance 12-bit analog-to-digital converter ADC with eight external inputs plus internal temperature and battery sensors on CC430F613x devices, a comparator, universal serial communication interfaces USCIs, a 128-bit AES security accelerator, a hardware multiplier, a DMA, a real-time clock RTC module with alarm capabilities, an LCD driver, and up to 44 I/O pins.

The CC430F513x series are microcontroller SoC configurations that combine the excellent performance of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32KB of in-system programmable flash memory, up to 4KB of RAM, two 16-bit timers, a high performance 12-bit ADC with six external inputs plus internal temperature and battery sensors, a comparator, universal serial communication interfaces USCIs, a 128-bit AES security accelerator, a hardware multiplier, a DMA, an RTC module with alarm capabilities, and up to 30 I/O pins.

Typical applications for these devices include wireless analog and digital sensor systems, heat cost allocators, thermostats, metering AMR or AMI, and smart grid wireless networks.

For complete module descriptions, see the _CC430 Family User’s Guide_ SLAU259.

CC430F5133IRGZR中文资料参数规格
技术参数

频率 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz

时钟频率 20.0 MHz

RAM大小 2 KB

位数 12

FLASH内存容量 8192 B

输出功率 13 dBm

UART数量 1

模数转换数ADC 6

待机电流 1.00 µA

天线接线 Differential

FRAM内存容量 0 B

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 2V ~ 3.6V

封装参数

安装方式 Surface Mount

引脚数 48

封装 VQFN-48

外形尺寸

封装 VQFN-48

物理参数

工作温度 -40℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 5A992.c

香港进出口证 NLR

CC430F5133IRGZR引脚图与封装图
CC430F5133IRGZR引脚图

CC430F5133IRGZR引脚图

CC430F5133IRGZR封装焊盘图

CC430F5133IRGZR封装焊盘图

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替代型号CC430F5133IRGZR
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: CC430F5133IRGZR

品牌: TI 德州仪器

封装:

当前型号

MSP430 SoC的射频核心 MSP430 SoC with RF Core

当前型号

型号: CC430F5133IRGZ

品牌: 德州仪器

封装:

完全替代

MSP430™系统芯片与射频核心 MSP430? SoC with RF Core

CC430F5133IRGZR和CC430F5133IRGZ的区别

型号: CC430F5133IRGZT

品牌: 德州仪器

封装:

类似代替

MSP430 SoC的射频核心 MSP430 SoC with RF Core

CC430F5133IRGZR和CC430F5133IRGZT的区别