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66AK2H12AAAWA2

66AK2H12AAAWA2

TI(德州仪器) 主动器件

多核DSPARM的KeyStone II系统级芯片(SoC ) Multicore DSPARM KeyStone II System-on-Chip SoC

* CorePac Processors * Quad or Dual Cortex-A15 processors * Eight or Four C66x DSP cores * Network AcceleratorPac * Packet coprocessor IPv4/IPv6 for Layer 2-4 * Security coprocessor IPSec/SRTP * Five-port 1-Gb Ethernet switch * Memory * Cache-coherent Multicore Shared Memory Controller MSMC * 1MB per core Level 2 RAM/cache * 6MB shared memory with ECC and cache coherency * Two DDR3/3L 1600 interfaces with ECC * KeyStone II Architecture * Multicore Navigator; brings single-core programming simplicity to multicore SoCs * 16,000 atomic hardware queues * TeraNet - on-chip interconnect providing more than two terabits per second throughput * Low power - 9-14 Watts at 55°C case temperature * High speed I/O * PCI Express Gen2-up to 10 Gbps * Serial RapidIO V2.1-up to 20 Gbps * USB 3.0 * HyperLink - up to 100 Gbaud for chip-to-chip interconnect * Three-port 10-Gb Ethernet switch 66AK2H14 only

66AK2H12AAAWA2中文资料参数规格
技术参数

RAM大小 6 MB

UART数量 2

工作温度Max 100 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 1517

封装 BBGA-1517

外形尺寸

封装 BBGA-1517

物理参数

工作温度 -40℃ ~ 100℃

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

66AK2H12AAAWA2引脚图与封装图
66AK2H12AAAWA2引脚图

66AK2H12AAAWA2引脚图

66AK2H12AAAWA2封装图

66AK2H12AAAWA2封装图

66AK2H12AAAWA2封装焊盘图

66AK2H12AAAWA2封装焊盘图

在线购买66AK2H12AAAWA2
型号 制造商 描述 购买
66AK2H12AAAWA2 TI 德州仪器 多核DSPARM的KeyStone II系统级芯片(SoC ) Multicore DSPARM KeyStone II System-on-Chip SoC 搜索库存