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W631GG6KB12I

W631GG6KB12I

数据手册.pdf

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA

GENERAL DESCRIPTION

The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin DDR3-1866 for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 13-13-13 specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 11-11-11 specification the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C. The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 9-9-9 specification the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C.

FEATURES

 Power Supply: VDD, VDDQ = 1.5V ± 0.075V

 Double Data Rate architecture: two data transfers per clock cycle

 Eight internal banks for concurrent operation

 8 bit prefetch architecture

 CAS Latency: 6, 7, 8, 9, 10, 11 and 13

 Burst length 8 BL8 and burst chop 4 BC4 modes: fixed via mode register MRS or selectable On The-Fly OTF

 Programmable read burst ordering: interleaved or nibble sequential

 Bi-directional, differential data strobes DQS and DQS# are transmitted / received with data

 Edge-aligned with read data and center-aligned with write data

 DLL aligns DQ and DQS transitions with clock

 Differential clock inputs CK and CK#

 Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair double data rate

 Posted CAS with programmable additive latency AL = 0, CL - 1 and CL - 2 for improved command, address and data bus efficiency

 Read Latency = Additive Latency plus CAS Latency RL = AL + CL

 Auto-precharge operation for read and write bursts

 Refresh, Self-Refresh, Auto Self-refresh ASR and Partial array self refresh PASR

 Precharged Power Down and Active Power Down

W631GG6KB12I中文资料参数规格
技术参数

供电电流 280 mA

位数 16

存取时间Max 0.225 ns

工作温度Max 95 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 96

封装 BGA

外形尺寸

封装 BGA

其他

产品生命周期 Obsolete

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 EAR99

香港进出口证 NLR

W631GG6KB12I引脚图与封装图
暂无图片
在线购买W631GG6KB12I
型号 制造商 描述 购买
W631GG6KB12I Winbond Electronics 华邦电子股份 DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA 搜索库存
替代型号W631GG6KB12I
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: W631GG6KB12I

品牌: Winbond Electronics 华邦电子股份

封装: TFBGA

当前型号

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA

当前型号

型号: W631GG6KB15I

品牌: 华邦电子股份

封装: TFBGA

类似代替

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA

W631GG6KB12I和W631GG6KB15I的区别

型号: W631GG6KB-11

品牌: 华邦电子股份

封装: TFBGA

类似代替

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA

W631GG6KB12I和W631GG6KB-11的区别

型号: W631GG6KB15K

品牌: 华邦电子股份

封装:

功能相似

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V Automotive 96Pin WBGA

W631GG6KB12I和W631GG6KB15K的区别