TMX320C5515AZCH12
TMS320C5515定点数字信号处理器 TMS320C5515 Fixed-Point Digital Signal Processor
Description
The device is a member of "s TMS320C5000™ fixed-point Digital Signal Processor DSP product family
and is designed for low-power applications.
Fixed-Point Digital Signal Processor
Features
• High-Performance, Low-Power, TMS320C55x™ • Universal Asynchronous Receiver/Transmitter
Fixed-Point Digital Signal Processor UART
– 16.67-, 13.33-, 10-, 8.33-ns Instruction Cycle • Serial-Port Interface SPI With Four ChipTime Selects
– 60-, 75-, 100-, 120-MHz Clock Rate • Master/Slave Inter-Integrated Circuit I2C Bus™
– One/Two Instructions Executed per Cycle • Four Inter-IC Sound I2S Bus™ for Data
Transport
– Dual Multipliers [Up to 200 or 240 Million Multiply-Accumulates per Second MMACS] • Device USB Port With Integrated 2.0 HighSpeed PHY that Supports:
– Two Arithmetic/Logic Units ALUs
– USB 2.0 Full- and High-Speed Device – Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses • LCD Bridge With Asynchronous Interface
– Software-Compatible With C55x Devices • Tightly-Coupled FFT Hardware Accelerator
– Industrial Temperature Devices Available • 10-Bit 4-Input Successive Approximation SAR ADC
• 320K Bytes Zero-Wait State On-Chip RAM, Composed of:
• Real-Time Clock RTC With Crystal Input, With Separate Clock Domain and Power Supply
– 64K Bytes of Dual-Access RAM DARAM, 8 Blocks of 4K x 16-Bit
• Four Core Isolated Power Supply Domains: Analog, RTC, CPU and Peripherals, and USB – 256K Bytes of Single-Access RAM SARAM, 32 Blocks of 4K x 16-Bit
• Four I/O Isolated Power Supply Domains: RTC I/O, EMIF I/O, USB PHY, and DV DDIO
• 128K Bytes of Zero Wait-State On-Chip ROM 4 Blocks of 16K x 16-Bit • Three integrated LDOs DSP_LDO, ANA_LDO, and USB_LDO to power the isolated domains:
• 4M x 16-Bit Maximum Addressable External DSP Core, Analog, and USB Core, respectively Memory Space SDRAM/mSDRAM
• Low-Power S/W Programmable Phase-Locked
• 16-/8-Bit External Memory Interface EMIF with Loop PLL Clock Generator Glueless Interface to:
• On-Chip ROM Bootloader RBL to Boot From
– 8-/16-Bit NAND Flash, 1- and 4-Bit ECC NAND Flash, NOR Flash, SPI EEPROM, SPI
– 8-/16-Bit NOR Flash Serial Flash or I2C EEPROM
– Asynchronous Static RAM SRAM
• IEEE-1149.1 JTAG
– SDRAM/mSDRAM 1.8-, 2.5-, 2.75-, and 3.3-V Boundary-Scan-Compatible
• Direct Memory Access DMA Controller
• Up to 26 General-Purpose I/O GPIO Pins
– Four DMA With 4 Channels Each 16-Multiplexed With Other Device Functions Channels Total
• 196-Terminal Pb-Free Plastic BGA Ball Grid
• Three 32-Bit General-Purpose Timers Array ZCH Suffix
– One Selectable as a Watchdog and/or GP
• 1.05-V Core 60 or 75 MHz, 1.8-V, 2.5-V, 2.75-V,
• Two MultiMedia Card/Secure Digital MMC/SD or 3.3-V I/Os Interfaces
• 1.3-V Core 100, 120 MHz, 1.8-V, 2.5-V, 2.75-V, or 3.3-V I/Os
Applications
• Wireless Audio Devices Headsets, Microphones, Speakerphones
• Echo Cancellation Headphones
• Portable Medical Devices
• Voice Applications
• Industrial Controls
• Fingerprint Biometrics
• Software Defined Radio
