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TPA751GQSR

TPA751GQSR

TI(德州仪器) 主动器件

功放。其他 Amplifier. Other

description

The TPA751 is a bridge-tied load BTL audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior BGA, 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

• Fully Specified for 3.3-V and 5-V Operation

• Wide Power Supply Compatibility 2.5 V − 5.5 V

• Power Supply Rejection at 217 Hz

   − 84 dB at VDD = 5 V

   − 81 dB at VDD = 3.3 V

• Output Power for RL = 8 Ω

   − 700 mW at VDD = 5 V

   − 250 mW at VDD = 3.3 V

• Ultralow Supply Current in Shutdown

   Mode . . . 1.5 nA

• Thermal and Short-Circuit Protection

• Surface-Mount Packaging

   − SOIC

   − PowerPAD MSOP

   − MicroStar Junior BGA

TPA751GQSR中文资料参数规格
技术参数

电源电压DC 5.50 V

电路数 1

通道数 1

静态电流 1.45 mA

输出功率 700 mW

电源电压 2.5V ~ 5.5V

封装参数

安装方式 Surface Mount

封装 VFBGA-24

外形尺寸

封装 VFBGA-24

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Active

包装方式 Cut Tape CT

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

TPA751GQSR引脚图与封装图
TPA751GQSR引脚图

TPA751GQSR引脚图

TPA751GQSR封装图

TPA751GQSR封装图

TPA751GQSR封装焊盘图

TPA751GQSR封装焊盘图

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