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TLV5614IYZT

TLV5614IYZT

TI(德州仪器) 主动器件

12位,四通道, 2.7V至5.5V , DAC的凸点芯片(晶圆级芯片)包 - ????无铅/绿色 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green

The TLV5614IYZ is a quadruple, 12-bit, voltage output digital-to-analog converter DAC with a flexible 4-wire serial interface. The serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5614IYZ is programmed with a 16-bit serial word comprised of a DAC address, individual DAC control bits, and a 12-bit DAC value. The device has provision for two supplies: one digital supply for the serial interface via pins DVDD and DGND, and one for the DACs, reference buffers, and output buffers via pins AVDD and AGND. Each supply is independent of the other, and can be any value between 2.7V and 5.5V. The dual supplies allow a typical application where the DAC is controlled via a microprocessor operating on a 3V supply also used on pins DVDD and DGND with the DACs operating on a 5V supply. Of course, the digital and analog supplies can also be tied together.

The resistor string output voltage is buffered by a 2x gain rail-to-rail output buffer. The buffer features a Class-AB output stage to improve stability and reduce settling time. A rail-to-rail output stage and a power-down mode makes it ideal for single voltage, battery-based applications. The DAC settling time is programmable, allowing the designer to optimize speed versus power dissipation. Settling time is chosen by the control bits within the 16-bit serial input string. A high-impedance buffer is integrated on the REFINAB and REFINCD terminals to reduce the need for a low source impedance drive to the terminal. REFINAB and REFINCD allow DACs A and B to have a different reference voltage than DACs C and D.

The TLV5614IYZ is built with a CMOS process and is available in a 16-terminal bumped die wafer chip scale package. It is characterized for operation from -40°C to +85°C in a wire-bonded, small outline SOIC package.

TLV5614IYZT中文资料参数规格
技术参数

输出接口数 4

供电电流 3.80 mA

通道数 4

位数 12

采样率 102 ksps

功耗 3.60 mW

过温保护 No

工作温度Max 85 ℃

工作温度Min -40 ℃

数模转换数DAC 4

封装参数

安装方式 Surface Mount

引脚数 16

封装 WCSP-16

外形尺寸

封装 WCSP-16

物理参数

工作温度 -40℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

TLV5614IYZT引脚图与封装图
TLV5614IYZT引脚图

TLV5614IYZT引脚图

TLV5614IYZT封装图

TLV5614IYZT封装图

TLV5614IYZT封装焊盘图

TLV5614IYZT封装焊盘图

在线购买TLV5614IYZT
型号 制造商 描述 购买
TLV5614IYZT TI 德州仪器 12位,四通道, 2.7V至5.5V , DAC的凸点芯片(晶圆级芯片)包 - ????无铅/绿色 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green 搜索库存
替代型号TLV5614IYZT
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: TLV5614IYZT

品牌: TI 德州仪器

封装: 16DSBGA 12Bit 16Pin

当前型号

12位,四通道, 2.7V至5.5V , DAC的凸点芯片(晶圆级芯片)包 - ????无铅/绿色 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green

当前型号

型号: TLV5614IYZR

品牌: 德州仪器

封装: DSBGA-16 12Bit 16Pin

功能相似

12位,四通道, 2.7V至5.5V , DAC的凸点芯片(晶圆级芯片)包 - ????无铅/绿色 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green

TLV5614IYZT和TLV5614IYZR的区别