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TMP007AIYZFT

TMP007AIYZFT

TI(德州仪器) 工业控制

TEXAS INSTRUMENTS  TMP007AIYZFT  温度传感器芯片, DSBGA, 8 引脚

The is a fully-integrated MEMS Thermopile Sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 to 16 µm within the end-user defined field of view. The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature. The TMP007 also provides non-volatile memory for storing calibration coefficients. The TMP007 is designed with portability and power in mind and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes. Low power consumption also makes it well suited for battery-powered applications.

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14-bit Local temperature sensor for cold junction reference - ±1.5°C maximum from -40 to +125°C
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Directly read object temperature
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Programmable alerts
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Non-volatile memory for storing calibration coefficients
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Transient correction
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Two-wire serial interface options I²C and SMBus compatible
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Eight programmable addresses
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270µA typical Low power active current
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2µA maximum Shutdown current
TMP007AIYZFT中文资料参数规格
技术参数

电源电压DC 2.50V min

针脚数 8

工作温度Max 125 ℃

工作温度Min -40 ℃

电源电压 2.5V ~ 5.5V

电源电压Max 5.5 V

电源电压Min 2.5 V

封装参数

安装方式 Surface Mount

引脚数 8

封装 DSBGA-8

外形尺寸

高度 0.28 mm

封装 DSBGA-8

物理参数

工作温度 -40℃ ~ 125℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

制造应用 医用, 传感与仪器, HVAC

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC版本 2015/06/15

TMP007AIYZFT引脚图与封装图
TMP007AIYZFT引脚图

TMP007AIYZFT引脚图

TMP007AIYZFT封装图

TMP007AIYZFT封装图

TMP007AIYZFT封装焊盘图

TMP007AIYZFT封装焊盘图

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