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SMOMAPL138BGWTA3R

SMOMAPL138BGWTA3R

TI(德州仪器) 主动器件

SMOMAPL138B低功耗应用处理器 SMOMAPL138B Low-Power Applications Processor

This device is a Low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000 platform of DSPs.

This device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer RISC technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 CP15, protection module, and Data and program Memory Management Units MMUs with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag VIVT. The ARM core also has a 8KB RAM Vector Table and 64KB ROM.

The device DSP core uses a two-level cache-based architecture. The Level 1 program cache L1P is a 32KB direct mapped cache and the Level 1 data cache L1D is a 32KB 2-way set-associative cache. The Level 2 program cache L2P consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC EMAC with a Management Data Input/Output MDIO module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit I2C Bus interfaces; one multichannel audio serial port McASP with 16 serializers and FIFO buffers; two multichannel buffered serial ports McBSP with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable one configurable as watchdog; a configurable 16-bit host port interface HPI ; up to 9 banks of 16 pins of general-purpose input/output GPIO with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces each with RTS and CTS; two enhanced high-resolution pulse width modulator eHRPWM peripherals; 3 32-bit enhanced capture eCAP module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator APWM outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface EMIFA for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.

The Ethernet Media Access Controller EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second Mbps and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I 1.5 Gbps and SATA II 3.0 Gbps.

The Universal Parallel Port uPP provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.

A Video Port Interface VPIF is included providing a flexible video input/output port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

This device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

SMOMAPL138BGWTA3R中文资料参数规格
技术参数

RAM大小 128 KB

UART数量 3

工作温度Max 105 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 361

封装 LFBGA-361

外形尺寸

封装 LFBGA-361

物理参数

工作温度 -40℃ ~ 105℃ TJ

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

海关信息

ECCN代码 3A991.a.2

SMOMAPL138BGWTA3R引脚图与封装图
SMOMAPL138BGWTA3R引脚图

SMOMAPL138BGWTA3R引脚图

在线购买SMOMAPL138BGWTA3R
型号 制造商 描述 购买
SMOMAPL138BGWTA3R TI 德州仪器 SMOMAPL138B低功耗应用处理器 SMOMAPL138B Low-Power Applications Processor 搜索库存
替代型号SMOMAPL138BGWTA3R
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: SMOMAPL138BGWTA3R

品牌: TI 德州仪器

封装: 361-LFBGA

当前型号

SMOMAPL138B低功耗应用处理器 SMOMAPL138B Low-Power Applications Processor

当前型号

型号: AM1808BZWTA3

品牌: 德州仪器

封装: 361NFBGA

完全替代

AM1808 ARM微处理器 AM1808 ARM Microprocessor

SMOMAPL138BGWTA3R和AM1808BZWTA3的区别

型号: AM1808BZWT4

品牌: 德州仪器

封装: NFBGA 1.25V 456MHz

类似代替

TEXAS INSTRUMENTS  AM1808BZWT4  芯片, 微处理器, ARM9, 361NFBGA

SMOMAPL138BGWTA3R和AM1808BZWT4的区别

型号: AM1808BZWT3

品牌: 德州仪器

封装: 361NFBGA 1.35V 375MHz

类似代替

AM1808 ARM微处理器 AM1808 ARM Microprocessor

SMOMAPL138BGWTA3R和AM1808BZWT3的区别