| | | | | 厂家: - 包装: 剪切带 系列: HSR312L 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 6-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: Ruidan-Reel® 系列: PVY, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 4-SOP (0.173", 4.40mm) |
| | | | | 厂家: - 包装: 整装 系列: PVG, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVG, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 6-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVG, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: S202 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 4-SIP |
| | | | | 厂家: - 包装: 管子 系列: S108 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 4-SIP |
| | | | | 厂家: - 包装: 整装 系列: PVU, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVD, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 8-SMD (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 8-SMD (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 8-SMD (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 8-SMD (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVN, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 6-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVD, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 整装 系列: PVT, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 整装 系列: PVT, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 整装 系列: PVN, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) x 2 封装/外壳: 8-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) x 2 封装/外壳: 8-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVX, HEXFRED™ 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 14-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Surface Mount 电路: SPST-NO (1 Form A) x 2 封装/外壳: 8-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVD, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVD, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) x 2 封装/外壳: 8-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVA, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) x 2 封装/外壳: 8-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVN, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 6-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 管子 系列: PVA, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 剪切带 系列: G3NA 安装类型: Chassis Mount 电路: SPST-NO (1 Form A) 封装/外壳: Hockey Puck |
| | | | | 厂家: - 包装: 管子 系列: PVA, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVA, BOSFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 8-DIP (0.300", 7.62mm), 4 Leads |
| | | | | 厂家: - 包装: 管子 系列: PVT, HEXFET® 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 6-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 剪切带 系列: PS, OCMOS 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 整装 系列: PR33MF 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 8-SMD (0.300", 7.62mm), 7 Leads |
| | | | | 厂家: - 包装: 管子 系列: LH1523 安装类型: Through Hole 电路: SPST-NC (1 Form B) x 2 封装/外壳: 8-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 包装: 剪切带 系列: SPF, PowerFin™ 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 4-SIP |
| | | | | 厂家: - 包装: 剪切带 系列: S202 安装类型: Through Hole 电路: SPST-NO (1 Form A) 封装/外壳: 4-SIP |
| | | | | 厂家: - 包装: 剪切带 系列: HA48 安装类型: Chassis Mount 电路: SPST-NO (1 Form A) 封装/外壳: Hockey Puck |
| | | | | 厂家: - 包装: 剪切带 系列: A48 安装类型: Chassis Mount 电路: SPST-NO (1 Form A) 封装/外壳: Hockey Puck |
| | | | | 厂家: - 包装: 剪切带 系列: H12D 安装类型: Chassis Mount 电路: SPST-NO (1 Form A) 封装/外壳: Hockey Puck |
| | | | | 厂家: - 包装: Ruidan-Reel® 系列: LH1525 安装类型: Surface Mount 电路: SPST-NO (1 Form A) 封装/外壳: 6-SMD (0.300", 7.62mm) |