M74HC670B1、TC74HC670AP、HD74HC670P-E对比区别

高亮显示差异参数

型号 M74HC670B1 TC74HC670AP HD74HC670P-E

描述 Register File Single 4CH CMOS 16Pin PDIPCMOS Digital Integrated Circuit Silicon Monolithic 4 Word — 4Bit Register File (3-state)4X4 STANDARD SRAM, 200ns, PDIP16, 6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-16

数据手册 ---

制造商 ST Microelectronics (意法半导体) Toshiba (东芝) Renesas Electronics (瑞萨电子)

分类

封装 DIP DIP DIP

安装方式 Through Hole - -

封装 DIP DIP DIP

产品生命周期 Unknown Obsolete Unknown

包装方式 Tube - -

RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant

含铅标准 Lead Free - -

工作温度 -55℃ ~ 125℃ - -