72T18125L5BBI、72T18125L6-7BB、72T18125L10BB对比区别

高亮显示差异参数

型号 72T18125L5BBI 72T18125L6-7BB 72T18125L10BB

描述 FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGAFIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA TrayFIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA

数据手册 ---

制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)

分类 FIFOFIFOFIFO

安装方式 Surface Mount Surface Mount Surface Mount

引脚数 240 240 240

封装 BGA-240 BGA-240 BGA-240

存取时间 5 ns 12ns, 3.8ns 14ns, 4.5ns

电源电压 2.375V ~ 2.625V 2.375V ~ 2.625V 2.375V ~ 2.625V

工作温度(Max) 85 ℃ - -

工作温度(Min) -40 ℃ - -

电源电压(Max) 2.625 V - -

电源电压(Min) 2.375 V - -

长度 19.0 mm 19.0 mm 19.0 mm

宽度 19 mm 19.0 mm 19.0 mm

封装 BGA-240 BGA-240 BGA-240

厚度 1.76 mm 1.76 mm 1.76 mm

工作温度 -40℃ ~ 85℃ 0℃ ~ 70℃ 0℃ ~ 70℃

产品生命周期 Active Active Active

包装方式 Tray Tray Tray

RoHS标准 Non-Compliant Non-Compliant Non-Compliant

含铅标准 Contains Lead Contains Lead Contains Lead

ECCN代码 EAR99 - -