MAX6023EBT25、MAX6023EBT25+T、MAX6023EBT25-T对比区别
型号 MAX6023EBT25 MAX6023EBT25+T MAX6023EBT25-T
描述 Precision, Low-Power, Low-Dropout, UCSP Voltage Reference串联 500uA高精度,低功耗,低压差, UCSP封装电压基准 Precision, Low-Power, Low-Dropout, UCSP Voltage Reference
数据手册 ---
制造商 Maxim Integrated (美信) Maxim Integrated (美信) Maxim Integrated (美信)
分类 电压基准芯片电压基准芯片电压基准芯片
安装方式 Surface Mount Surface Mount Surface Mount
引脚数 - 5 5
封装 FBGA UCSP-5 UCSP
电源电压(DC) - 2.50V (min) 2.50V (min)
容差 - ±0.2 % -
输入电压(DC) - 2.70V ~ 12.6V 2.70V ~ 12.6V
输出电压 - 2.5 V -
输出电流 - 500 µA -
供电电流 - 35 µA -
通道数 - 1 -
输出电压(Min) - 2.5 V -
输入电压 - 2.7V ~ 12.6V -
封装 FBGA UCSP-5 UCSP
工作温度 - -40℃ ~ 85℃ (TA) -
温度系数 - ±30 ppm/℃ ±10.0 ppm/℃
产品生命周期 Unknown Unknown Unknown
包装方式 - Tape & Reel (TR) Tape & Reel (TR)
RoHS标准 RoHS Compliant RoHS Compliant RoHS Compliant
含铅标准 Lead Free Lead Free Lead Free