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IS43DR16320D-25DBI-TR

IS43DR16320D-25DBI-TR

数据手册.pdf
Integrated Silicon SolutionISSI 电子元器件分类

动态随机存取存储器 512M, 1.8V, 400Mhz 32M x 16 DDR2

SDRAM - DDR2 存储器 IC 512Mb(32M x 16) 并联 84-TWBGA(8x12.5)


得捷:
IC DRAM 512MBIT PARALLEL 84TWBGA


贸泽:
动态随机存取存储器 512M, 1.8V, 400Mhz 32M x 16 DDR2


艾睿:
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin TW-BGA T/R


安富利:
ISSI"s 512Mb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls.Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed BA0-BA1 select the bank; A0-A12x16 or A0-A13x8 select the row. The address bits registered coincident with the Read or Write command are used to select the starting column location A0-A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be


Win Source:
IC DDR2 512MB 400MHZ CL5 84BGA


IS43DR16320D-25DBI-TR中文资料参数规格
技术参数

位数 16

存取时间 400 ps

存取时间Max 0.4 ns

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 1.7V ~ 1.9V

封装参数

安装方式 Surface Mount

引脚数 84

封装 BGA-84

外形尺寸

封装 BGA-84

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 Non-Compliant

含铅标准

海关信息

ECCN代码 EAR99

IS43DR16320D-25DBI-TR引脚图与封装图
暂无图片
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