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IRF6614TRPBF

IRF6614TRPBF

数据手册.pdf
International Rectifier 国际整流器 分立器件

Trans MOSFET N-CH 40V 12.7A 7Pin Direct-FET ST T/R

Description

The IRF6614PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infrared or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6614PbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6614PbF has been optimized for parameters that are critical in synchronous buck operating from 12 volt bus converters including Rdson and gate charge to minimize losses in the control FET socket.

RoHS Compliant

Lead-Free Qualified up to 260°C Reflow

Application Specific MOSFETs

Ideal for CPU Core DC-DC Converters

Low Conduction Losses and Switching Losses

Low Profile <0.7mm

Dual Sided Cooling Compatible

Compatible with existing Surface Mount Techniques

IRF6614TRPBF中文资料参数规格
技术参数

额定电压DC 40.0 V

额定电流 12.7 A

极性 N-Channel

耗散功率 2.1 W

产品系列 IRF6614

输入电容 2.56 nF

栅电荷 29.0 nC

漏源极电压Vds 40 V

漏源击穿电压 40.0 V

连续漏极电流Ids 10.1 A

输入电容Ciss 2560pF @20VVds

额定功率Max 2.1 W

封装参数

安装方式 Surface Mount

引脚数 7

封装 Direct-FET

外形尺寸

封装 Direct-FET

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

IRF6614TRPBF引脚图与封装图
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