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FF1200R17IP5BPSA1

FF1200R17IP5BPSA1

数据手册.pdf
Infineon(英飞凌) 电子元器件分类

1700V PrimePACK™2 dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC.

Summary of Features:

.
Extended operating temperature T vjop = 175°C
.
Output current increased by more than 25% in the same footprint
.
Copper Bonds for high current carrying capabilities
.
Sintering of chips for highest power cycling capabilities
.
Total losses reduced by up to 20%
.
Package with CTI > 400

 

Benefits:

.
Increase in Power Density by up to 25%
.
Up to 10 times longer lifetime
.
Less cooling effort for same output power
.
Enables higher system overload conditions
FF1200R17IP5BPSA1中文资料参数规格
技术参数

击穿电压集电极-发射极 1700 V

输入电容Cies 68nF @25V

额定功率Max 20 mW

封装参数

封装 AG-PRIME2-5

外形尺寸

封装 AG-PRIME2-5

物理参数

工作温度 -40℃ ~ 175℃ TJ

其他

产品生命周期 Active

包装方式 Tray

制造应用 Commercial and Agriculture Vehicles, Drives, Wind, Traction

符合标准

RoHS标准

含铅标准 Lead Free

FF1200R17IP5BPSA1引脚图与封装图
FF1200R17IP5BPSA1电路图

FF1200R17IP5BPSA1电路图

在线购买FF1200R17IP5BPSA1
型号 制造商 描述 购买
FF1200R17IP5BPSA1 Infineon 英飞凌 1700V PrimePACK™2 dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC. 搜索库存