FP50R12KT3

IGBT模块

Summary of Features:

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Low stray inductance module design

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High reliability and power density

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Copper base plate for optimized heat spread

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Solderable pins

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Low switching losses

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High switching frequency

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RoHS-compliant modules

Benefits:

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Compact module concept

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Optimized customer’s development cycle time and cost

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Configuration flexibility

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Fast, reliable and low cost mounting concept