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CC2564NSYFVT

CC2564NSYFVT

TI 德州仪器 电子元器件分类

Bluetooth 2.2 to 4.8V 4Mbps 54Pin DSBGA SMD T/R

* Single-Chip Bluetooth Solution Integrating Bluetooth Basic Rate BR/Enhanced Data Rate EDR/Low Energy LE Features Fully Compliant With the Bluetooth 4.0 Specification Up to the HCI Layer * BR/EDR Features Include: * Up to 7 Active Devices * Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves * Up to 2 SCO Links on the Same Piconet * Support for All Voice Air-Coding – Continuously Variable Slope Delta CVSD, A-Law, μ-Law, and Transparent Uncoded * CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech WBS Profile or A2DP Profile to Reduce Host Processing and Power * LE Features Include: * Support of Up to 10 CC2564 and CC2564B Simultaneous Connections * Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption * Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance. * Built-In Coexistence and Prioritization Handling for BR/EDR and LE * Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex™-M3 and Cortex™-M4 MCUs * Highly Optimized for Low-Cost Designs: * Single-Ended 50-Ω RF Interface * Package Footprint: 76 Pins, 0.6-mm Pitch, 8.10-mm x 8.10-mm mrQFN * Best-in-Class Bluetooth RF Performance TX Power, RX Sensitivity, Blocking * Class 1.5 TX Power Up to +12 dBm * Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required * Improved Adaptive Frequency Hopping AFH Algorithm With Minimum Adaptation Time * Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions * ROM Spin to Enable Offload Host and Save Current With Assisted Audio SBC Encode and Decode On Chip * Advanced Power Management for Extended Battery Life and Ease of Design: * On-Chip Power Management, Including Direct Connection to Battery * Low Power Consumption for Active, Standby, and Scan Bluetooth Modes * Shutdown and Sleep Modes to Minimize Power Consumption * Physical Interface: * Fully Programmable Digital PCM-I2S Codec Interface * CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack * Device Pin-to-Pin Compatible With Previous Devices or Modules

CC2564NSYFVT中文资料参数规格
技术参数

输出功率 12 dBm

工作温度Max 85 ℃

工作温度Min 40 ℃

电源电压Max 4.8 V

电源电压Min 2.2 V

封装参数

安装方式 Surface Mount

封装 DSBGA-54

外形尺寸

封装 DSBGA-54

物理参数

工作温度 40℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

CC2564NSYFVT引脚图与封装图
暂无图片
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型号 制造商 描述 购买
CC2564NSYFVT TI 德州仪器 Bluetooth 2.2 to 4.8V 4Mbps 54Pin DSBGA SMD T/R 搜索库存
替代型号CC2564NSYFVT
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: CC2564NSYFVT

品牌: TI 德州仪器

封装:

当前型号

Bluetooth 2.2 to 4.8V 4Mbps 54Pin DSBGA SMD T/R

当前型号

型号: CC2564YFVT

品牌: 德州仪器

封装: DSBGA-54

类似代替

射频收发器 Bluetooth Cntlr

CC2564NSYFVT和CC2564YFVT的区别

型号: CC2564NYFVT

品牌: 德州仪器

封装:

类似代替

Bluetooth 4Mbps 54Pin DSBGA T/R

CC2564NSYFVT和CC2564NYFVT的区别

型号: CC2564BRVMT

品牌: 德州仪器

封装:

功能相似

TEXAS INSTRUMENTS  CC2564BRVMT  芯片, 射频收发器, 2.4-2.48GHZ, VQFN-76

CC2564NSYFVT和CC2564BRVMT的区别