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C2012X7R1H223K/0.60

C2012X7R1H223K/0.60

数据手册.pdf
TDK(东电化) 被动器件

CAP CER 0.022uF 50V X7R 0805

Features

• High capacitance has been achieved through precision

technologies that enable the use of multiple thinner

ceramic dielectric layers.

• A monolithic structure ensures superior mechanical

strength and reliability.

• High-accuracy automatic mounting is facilitated through

the maintenance of very precise dimensional tolerances.

• Composed of only ceramics and metals, these

capacitors provide extremely dependable performance,

exhibiting virtually no degradation even when subjected to

temperature extremes.

• Low stray capacitance ensures high conformity with

nominal values, thereby simplifying the circuit design

process.

• Low residual inductance assures superior frequency

characteristics.

• Because electrostatic capacity has been obtained up to

the electrolytic capacitor range, these capacitors offer

long service life and are optimally suited for power supply

designs that require high levels of reliability.

• Owing to their low ESR and excellent frequency

characteristics, these products are optimally suited for

high frequency and high-density type power supplies

Applications

• Electronics equipment

• Mobile communications equipment

• Office automation equipment

• Automotive electronics

• Test and measurement equipment

• Hybrid ICs, etc.

• Decoupling

• Smoothing

• Charge pump

C2012X7R1H223K/0.60中文资料参数规格
技术参数

额定电压DC 50.0 V

电容 22.0 mF

容差 ±10 %

电介质特性 X7R

额定电压 50 V

封装参数

安装方式 Surface Mount

引脚数 2

封装 0805

外形尺寸

封装 0805

物理参数

工作温度 -55℃ ~ 125℃

其他

产品生命周期 Obsolete

包装方式 Tape & Reel TR

制造应用 通用

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

C2012X7R1H223K/0.60引脚图与封装图
C2012X7R1H223K/0.60引脚图

C2012X7R1H223K/0.60引脚图

C2012X7R1H223K/0.60封装图

C2012X7R1H223K/0.60封装图

C2012X7R1H223K/0.60封装焊盘图

C2012X7R1H223K/0.60封装焊盘图

在线购买C2012X7R1H223K/0.60
型号 制造商 描述 购买
C2012X7R1H223K/0.60 TDK 东电化 CAP CER 0.022uF 50V X7R 0805 搜索库存
替代型号C2012X7R1H223K/0.60
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: C2012X7R1H223K/0.60

品牌: TDK 东电化

封装: 22mF ±10% 50V X7R

当前型号

CAP CER 0.022uF 50V X7R 0805

当前型号

型号: CC0805KRX7R9BB223

品牌: 国巨

封装: 0805 22nF 50V 10per

功能相似

0805 0.022 uF 50 V ±10 % 容差 X7R 表面贴装 陶瓷 电容

C2012X7R1H223K/0.60和CC0805KRX7R9BB223的区别

型号: GRM216R71H223KA01D

品牌: 村田

封装: 22nF 50V ±10%

功能相似

MURATA  GRM216R71H223KA01D  多层陶瓷电容器, 表面贴装, GRM系列, 0.022 µF, ± 10%, X7R, 50 V, 0805 [2012 公制]

C2012X7R1H223K/0.60和GRM216R71H223KA01D的区别

型号: CL21B223KBANNNC

品牌: 三星

封装: 0805 22nF 50V 10per

功能相似

Samsung 0805 X7R/Y5V MLCC series reels### 0805 系列镍挡板终端覆镀锡 NiSn 层,应用包括移动电话、视频和调谐器设计,COG/NPO 是“温度补偿”的最常见配方,为 EIA I 类陶瓷材料,X7R、X5R 配方称为“温度稳定”陶瓷,属于 EIA II 类材料,Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。

C2012X7R1H223K/0.60和CL21B223KBANNNC的区别