![C2012X6S1C475M125AC](https://image.ruidan.com/images/ics/ic_58/chanpintu/c2012x6s1c475m125ac-fmaJb8jE-2qpg1dLxZ.png)
额定电压DC 16.0 V
电容 4.70 µF
容差 ±20 %
电介质特性 X6S
额定电压 16 V
安装方式 Surface Mount
封装公制 2012
封装 0805
长度 2.00 mm
宽度 1.25 mm
高度 1.25 mm
封装公制 2012
封装 0805
厚度 1.25 mm
材质 X6S/-55℃~+105℃
介质材料 Ceramic Multilayer
工作温度 -55℃ ~ 105℃
产品生命周期 Production Not Recommended for New Design
包装方式 Tape & Reel TR
最小包装 3000
制造应用 通用, Commercial Grade
RoHS标准 RoHS Compliant
含铅标准 Lead Free
![C2012X6S1C475M125AC引脚图](https://image.ruidan.com/images/ics/ic_58/yinjiaotu/c2012x6s1c475m125ac-fmaJb8jE-eZngWeXPq.png)
C2012X6S1C475M125AC引脚图
![C2012X6S1C475M125AC封装图](https://image.ruidan.com/images/ics/ic_58/fengzhuangtu/c2012x6s1c475m125ac-202006052w-2qpMaADKo.png)
C2012X6S1C475M125AC封装图
![C2012X6S1C475M125AC封装焊盘图](https://image.ruidan.com/images/ics/ic_58/hanpantu/c2012x6s1c475m125ac-202006052w-nqQyBOnBq.png)
C2012X6S1C475M125AC封装焊盘图
型号 | 制造商 | 描述 | 购买 |
---|---|---|---|
C2012X6S1C475M125AC | TDK 东电化 | 0805 4.7uF ±20% 16V X6S | 搜索库存 |
图片 | 型号/品牌/封装 | 代替类型 | 描述 | 替代型号对比 |
---|---|---|---|---|
型号: C2012X6S1C475M125AC 品牌: TDK 东电化 封装: 2012 4.7uF 16V 20per | 当前型号 | 0805 4.7uF ±20% 16V X6S | 当前型号 | |
型号: C2012X6S1C475K125AC 品牌: 东电化 封装: 2012 4.7uF 10per 16V X6S | 类似代替 | 0805 4.7uF ±10% 16V X6S | C2012X6S1C475M125AC和C2012X6S1C475K125AC的区别 | |
型号: C2012X6S1H475K125AC 品牌: 东电化 封装: 2012 4.7uF 50V 10per | 功能相似 | TDK C2012X6S1H475K125AC 多层陶瓷电容器, 表面贴装, C Series, 4.7 µF, ± 10%, X6S, 50 V, 0805 [2012 公制] 新 | C2012X6S1C475M125AC和C2012X6S1H475K125AC的区别 | |
型号: C2012X6S1H475M125AC 品牌: 东电化 封装: 2012 4.7uF 50V 20per | 功能相似 | 0805 4.7uF ±20% 50V X6S | C2012X6S1C475M125AC和C2012X6S1H475M125AC的区别 |