902-21-2-23-2-B-0

WAKEFIELD SOLUTIONS  902-21-2-23-2-B-0  散热器, 用于芯片组, 10.27 °C/W

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEATSINK 21X21X23MM PIN

贸泽:
Heat Sinks CHIPSET H/S PIN FIN 21mm 22.6mm H B/A

e络盟:
WAKEFIELD SOLUTIONS  902-21-2-23-2-B-0  散热器, 用于芯片组, 10.27 °C/W

Allied Electronics:
Heatsink; Fin Pin with clip assembly; 21 x 22.6 mm

Verical:
902-21-2-23-2-B-0

Newark:
# WAKEFIELD SOLUTIONS  902-21-2-23-2-B-0  Heat Sink, Square, Chipset, 10.27 °C/W, 22.6 mm, 21 mm, 21 mm