907-33-2-21-2-B-0

Heatsink; Fin Pin with clip assembly; 33 x 20.6mm

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEAT SINK PIN FIN 33X33MM CLIP

Allied Electronics:
Heatsink; Fin Pin with clip assembly; 33 x 20.6 mm