7-5L

Soder-Wick® 脱焊 脱焊 封装在静电耗散卷轴。大大缩短了返工/维修的时间 最大程度减小对板造成损害的风险 已获专利的无腐蚀性、不含卤化物的免洗有机助焊剂 BGA 脱焊 设计用于去除 BGA 焊盘和芯片上的焊料### 注系列 50 和系列 82 包含松香和松香 SD### 脱焊芯和脱焊带

Chem-Wik® Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik® Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact” pressure for greater operator control. All sizes are coated with a Type “R” organic flux system.

**Features**

* Requires little or no post solder cleaning

* No corrosive residues

* Optimized weave design for faster wicking and heat transfer

* Halide free

* Minimal risk of heat damage to components and circuit boards