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745C101332JP

745C101332JP

数据手册.pdf
CTS 西迪斯 被动器件

Res Thick Film Array 3.3KΩ 5% 0.5W1/2W ±200ppm/℃ BUS Molded 10Pin 2512 Concave SMD T/R

Res Thick Film Array 3.3K Ohm 5% 0.5W1/2W ±200ppm/°C BUS Molded 10-Pin 2512 Concave SMD T/R


得捷:
RES ARRAY 8 RES 3.3K OHM 2512


艾睿:
Looking to save space and power in your circuit design? The 745C101332JP resistor array from CTS gives you a solution by combining multiple resistors into a single chip. This product&s;s 8 resistors have a value of 3.3K Ohm. Its temperature coefficient is ±200 ppm/°C. This dependable part has a power rating of 0.5 1/2 W and a power rating per resistor of 0.063 1/16 W. It has 10 terminals. In order to guarantee safe delivery and allow for quick mounting of this component after delivery, it will be enclosed in tape and reel packaging during shipment. This product&s;s terminal pitch is 1.27 mm. This device is made with thick film technology. This part has an operating temperature of -55 to 125 °C. It has a tolerance of 5%. The 745C101332JP part has a concave termination style. This product is 6.4 mm long, 0.64 mm tall and 3.2 mm deep.


安富利:
Res Thick Film Array 3.3K Ohm 5% 1/2W ±200ppm/°C BUS Molded 10-Pin 2512 Concave SMD Plastic T/R


Chip1Stop:
Res Thick Film Array 3.3K Ohm 5% 0.5W1/2W ±200ppm/℃ BUS Molded 10-Pin 2512 Concave SMD Plastic T/R


Verical:
Res Thick Film Array 3.3K Ohm 5% 0.5W1/2W ±250ppm/C BUS 10-Pin 2512 Concave SMD Medical T/R


Online Components:
Res Thick Film Array 3.3K Ohm 5% 0.5W1/2W ±200ppm/°C BUS Molded 10-Pin 2512 Concave SMD T/R


Electro Sonic:
Res Thick Film Array 3.3K Ohm 5% 0.5W1/2W ±250ppm/°C BUS 10-Pin 2512 Concave SMD T/R


745C101332JP中文资料参数规格
技术参数

容差 ±5 %

额定功率 0.5 W

耗散功率 0.063 W

电阻 3.3 KΩ

工作温度Max 125 ℃

工作温度Min -55 ℃

额定电压 50 V

封装参数

安装方式 Surface Mount

引脚数 10

封装公制 6432

封装 2512

外形尺寸

长度 6.4 mm

宽度 3.2 mm

高度 0.64 mm

封装公制 6432

封装 2512

物理参数

工作温度 -55℃ ~ 125℃

温度系数 ±200 ppm/℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

制造应用 -

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 EAR99

745C101332JP引脚图与封装图
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