647-10-ABEP

WAKEFIELD SOLUTIONS  647-10-ABEP  散热器, 用于电路板级功率半导体, TO-220, 3.8 °C/W, 25.4 mm, 41.9 mm, 25.4 mm

The is a 25.4mm high-performance board level power semiconductor Heat Sink with aluminium, black anodized, 3.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting of larger devices on printed circuit boards.

e络盟:
散热器, 用于电路板级功率半导体, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm