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624-60AB
Wakefield Engineering 过温保护器件

WAKEFIELD SOLUTIONS  624-60AB  散热器, BGA/LED, 21 X 15.2MM

The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks DVD and global positioning systems GPS.


得捷:
HEATSINK FOR 21MM BGA


贸泽:
Heat Sinks HEATSINK BGA


e络盟:
散热器, BGA/LED, 21 X 15.2MM


Allied Electronics:
Heatsink; Omnidirectional; 0.598 in.; 15.2mm; Black Anodized


Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Verical:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Newark:
# WAKEFIELD SOLUTIONS  624-60AB  Heat Sink, Square, Black Anodized, For Ball Grid Arrays, Penguin Cooler, Pin Fin Clip-On, BGA


MASTER:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


624-60AB中文资料参数规格
封装参数

安装方式 Surface Mount

封装 BGA

外形尺寸

长度 21 mm

宽度 21 mm

高度 15.2 mm

封装 BGA

物理参数

颜色 Black

材质 Aluminum

重量 11.8 g

其他

产品生命周期 Active

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC版本 2015/12/17

海关信息

ECCN代码 EAR99

HTS代码 8542900000

624-60AB引脚图与封装图
暂无图片
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