Soder-Wick® 脱焊 脱焊 封装在静电耗散卷轴。大大缩短了返工/维修的时间 最大程度减小对板造成损害的风险 已获专利的无腐蚀性、不含卤化物的免洗有机助焊剂 BGA 脱焊 设计用于去除 BGA 焊盘和芯片上的焊料 卷轴长度 1.5 或 3m ### 注系列 50 和系列 82 包含松香和松香 SD### 脱焊芯和脱焊带
Soder-Wick® is designed for today’s heat sensitive
electronic components using lighter mass,
pure copper braid construction that allows
for better thermal conductivity, even at low
temperatures. Soder-Wick® responds faster
than conventional desoldering braids
thereby minimizing overheating and
preventing PCB damage. A full range of
sizes and flux types are available, including
Rosin, No Clean, unfluxed and a high
temperature Lead-Free version.
