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ATWINC1510-MR210PB1952

ATWINC1510-MR210PB1952

数据手册.pdf
Microchip(微芯) 电子元器件分类

射频收发器模块, 16/64-QAM, D B QPSK, OFDM, 72.2Mbps, 2.472GHz, 18.5dBm, 3V至4.2V, SPI

The from is an IEEE 802.11 b/g/n SmartConnect IoT module. It is a 28 pin certified module with ATWINC1510B chip 8MB flash and PCB printed antenna. This low power consumption IoT Internet of Things module is specifically optimized for low power IoT applications. The module integrates power amplifier, LNA, switch, power management and printed antenna resulting in a small form factor 21.7 x 14.7 x 2.1mm design. With seamless roaming capabilities and advanced security, it could be interoperable with various vendors 802.11 b/g/n access points in wireless LAN. The module provides SPI ports to interface with host controller. Superior MAC throughput via hardware accelerated two level A-MSDU/A-MPDU frame aggregation and block acknowledgment. RF performance guaranteed at room temperature of 25°C with a 2-3db change at boundary conditions. It also has Wi-Fi alliance certifications for connectivity and optimizations.

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IEEE 802.11 b/g/n 20MHz 1x1 solution, single spatial stream in 2.4GHz ISM band
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Integrated transmit/receive switch, fast boot options, on-chip network stack to offload MCU
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Superior sensitivity and range via advanced PHY signal processing
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FCC, IC, CE regulatory certification, advanced carrier and timing synchronization
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Advanced equalization and channel estimation, no OTA/with shield, Wi-Fi direct and soft-AP support
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Power save modes 4µA power down mode typical at 3.3V I/O, 3V to 4.2V VBATT voltage
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Supports IEEE 802.11 WEP, WPA, WPA2 security and -40°C to +85°C operating temperature
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On-chip memory management engine to reduce host load, built-in 26MHz crystal
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2.7V to 3.6V I/O operating voltage, Wi-Fi alliance certifications for connectivity and optimizations
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Integrated flash memory for system software
ATWINC1510-MR210PB1952中文资料参数规格
技术参数

频率 2.4 GHz

输出功率 18.5 dBm

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 2.7V ~ 3.6V

电源电压Max 4.2 V

电源电压Min 3 V

封装参数

安装方式 Surface Mount

引脚数 28

封装 MODULE

外形尺寸

封装 MODULE

物理参数

工作温度 -40℃ ~ 85℃

其他

产品生命周期 Unknown

包装方式 Tray

制造应用 嵌入式设计与开发

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

ATWINC1510-MR210PB1952引脚图与封装图
暂无图片
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型号 制造商 描述 购买
ATWINC1510-MR210PB1952 Microchip 微芯 射频收发器模块, 16/64-QAM, D B QPSK, OFDM, 72.2Mbps, 2.472GHz, 18.5dBm, 3V至4.2V, SPI 搜索库存