锐单电子商城 , 一站式电子元器件采购平台!
  • 电话:400-990-0325

127-0693-001

127-0693-001

数据手册.pdf
Cinch Connectivity Solutions 连接器与适配器

射频/同轴, SMP, 母, 直型, 50Ω, 焊接

Emerson’s new
.
*Johnson®** line of **SMP Blind-Mate Connectors** offers our customers a Micro-Miniature, Slide-On/Snap-On Interconnect System that aid’s in the design of high-density packaging as well as axial and radial misalignment issues. The SMP Interface offers superior performance up to 40 GHz and is compatible with all SMP and GPO® Connectors. They offer high electrical reliability where extreme shock and vibration condition’s are experienced.

 

One of the key benefits of the SMP connector interface is its use in high frequency blind-mate applications. The design of the SMP bullet and shroud system allows for both axial and radial misalignment. The basic system is comprised of an inner “bullet” adapter, and two outer receptacles called “shrouds”. The bullet provides a flexible link between the shroud connections.

 

In blind-mate applications, one shroud connector will be typically specified as a snap-on interface and the other as a slide-on. This ensures that the bullet adapter remains fixed in the same shroud connector when the connection is disengaged.

The two snap-on interfaces Full Detent FD and Limited Detent LD each have different engage and disengage coupling forces. The LD is typically selected as the snap-on interface in PCB mount or blind-mate applications, while the FD is mainly used for cabled connections where higher retention forces are required.

 

The two slide-on interfaces Smooth Bore SM and Catcher’s Mitt CM allow for reduced connection forces as compared to the snap-on versions. The push-on interface creates a sliding connection that does not physically locate the mating reference planes, allowing for axial and radial misalignment. Both the SM and CM have the same engage/disengage forces; however the CM is typically specified as the shroud configuration in blind-mate applications as its generous lead-in chamfer helps capture and guide the bullet into place.

127-0693-001中文资料参数规格
技术参数

极性 Male

频率 40 GHz

工作温度Max 165 ℃

工作温度Min -65 ℃

额定电压 335 V

封装参数

安装方式 Solder

物理参数

外壳颜色 Gold

触点材质 Beryllium Copper

工作温度 -65℃ ~ 165℃

其他

产品生命周期 Active

包装方式 Bulk

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 EAR99

HTS代码 8536694010

127-0693-001引脚图与封装图
暂无图片
在线购买127-0693-001
型号 制造商 描述 购买
127-0693-001 Cinch Connectivity Solutions 射频/同轴, SMP, 母, 直型, 50Ω, 焊接 搜索库存