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XC7Z035-L2FBG676I

XC7Z035-L2FBG676I

数据手册.pdf
Xilinx(赛灵思) 电子元器件分类

XC7Z035 L2FBG676I 磨码

* Dual-core ARM® Cortex™-A9 Based Application Processor Unit APU * 2.5 DMIPS/MHz per CPU * CPU frequency: Up to 1 GHz * Coherent multiprocessor support * ARMv7-A architecture * TrustZone® security * Thumb®-2 instruction set * Jazelle® RCT execution Environment Architecture * NEON™ media-processing engine * Single and double precision Vector Floating Point Unit VFPU * CoreSight™ and Program Trace Macrocell PTM * Timer and Interrupts * 32 KB Level 1 4-way set-associative instruction and data caches independent for each CPU * 512 KB 8-way set-associative Level 2 cache shared between the CPUs * Byte-parity support * On-chip boot ROM * 256 KB on-chip RAM OCM * Byte-parity support * Multiprotocol dynamic memory controller * 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories * ECC support in 16-bit mode * 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories * Static memory interfaces * Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support * Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints * Two SD/SDIO 2.0/MMC3.31 compliant controllers * Two full-duplex SPI ports with three peripheral chip selects * Two high-speed UARTs up to 1 Mb/s * Two master and slave I2C interfaces * GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O one bank of 32b and one bank of 22b and up to 64 bits up to two banks of 32b connected to the Programmable Logic * Up to 54 flexible multiplexed I/O MIO for peripheral pin assignments * True Dual-Port * Up to 72 bits wide * Configurable as dual 18 Kb

XC7Z035-L2FBG676I中文资料参数规格
技术参数

RAM大小 256 KB

封装参数

引脚数 676

封装 BBGA-676

外形尺寸

封装 BBGA-676

物理参数

工作温度 -40℃ ~ 100℃ TJ

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 3A991D

XC7Z035-L2FBG676I引脚图与封装图
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