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MPC8270CVVQLDA

MPC8270CVVQLDA

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NXP(恩智浦) 电子元器件分类

NXP  MPC8270CVVQLDA  芯片, 微控制器, 32位, POWER, 333MHZ, TBGA-480

Overview

Introducing the next generation of PowerQUICC® II™ processors: the MPC8270, MPC8275 and MPC8280.

Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.

The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module CPM. The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.

**A range of performance and package options**

Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture"s industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.

The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

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## Features

**MPC8270ZQ/VR Features**

* 603e core with 16K inst and 16K data caches

* 64-bit 60x bus, 32-bit PCI/local bus

* 128K ROM, 32K IRAM, 32K DPRAM

* Three FCCs for 10/100 Ethernet

* 128 HDLC channels, 4 TDMs

* 4 SCCs, 2 SMCs, SPI, I2C

* Memory controller built from SDRAM, UPM, GPCM machines

* New features -- USB, RMII

* Performance

* 266 MHz CPU, 200 MHz CPM, 66 MHz bus

* ~ 1W @ full performance, 1.5V

* Technology

* HIP7AP .13 micron, 3.3V I/O, 1.5V Core

* 516 PBGA, 27x27mm, 1mm ball pitch

* ZQ package has lead-bearing spheres

* VR package is lead-free

**MPC8270ZU 480 TBGA Features**

* 64-bit 60x bus, 32-bit PCI bus

* 333 MHz CPU, 250 MHz CPM, 83 MHz bus

* 450 MHz CPU, 300 MHz CPM, 100 MHz bus

* Less than 2W @ full performance, 1.5V

* HIP7AP, 3.3V I/O, 1.5V Core

* 480 TBGA, 37.5x37.5mm, 1.27mm ball pitch

## Features

* 480 TBGA, 37.5x37.5mm, 1.27mm ball pitchComparison Table

### MPC8280 Family

| 8270VR| 8270| 8275VR| 8280

\---|---|---|---|---

**SMCs** | 2 | 2 | 2 | 2

**Multichannel HDLC** | 128 | 128 | 128 | 256

**FCCs** | 3 | 3 | 3 | 3

**UTOPIA ATM** | 0 | 0 | 2 | 2

**USB** | 1 | 1 | 1 | 1

**Package** | 516 PBGA | 480 TBGA | 516 PBGA | 480 TBGA

**IMA/TC Functionality** | NO | NO | NO | YES

**MII/RMII Fast Ethernet** | 3 | 3 | 3 | 3

**SCCs** | 4 | 4 | 4 | 4

**60x/Memory Bus** | 66 | 83/100 | 66 | 83/100

**CPM** | 166 | 250/300 | 166 | 250/300

**CPU** | 266 | 333/450 | 266 | 333/450

**Local Bus** | - | 83/100 | - | 83/100

**I2C/SPI** | 1 | 1 | 1 | 1

**PCI** | YES | YES | YES | YES

**I/D Cache** | 16/16 | 16/16 | 16/16 | 16/16

### PowerQUICC II Masks and Versions

| IMMR_ [16-31]1 | Rev_Num2 | Qualification | Revision | Process | Mask

\---|---|---|---|---|---|---

**MPC8260 Family** | | | XC | A.1

B.3

C.2 | 0.29 µm

HiP3 | 0K26N

3K23A

6K23A, 7K23A

**MPC8260 Family** | | | XC

MC

MC | A.0

B.1

C.0 | 0.25 µm

HiP4 | 2K25A

4K25A

5K25A

**MPC8280 Family** | | | -

MC

MC | 0

0.1

A.0 | 0.13 µm

HiP7 | 0K49M

1K49M

2K49M, 3K49M

**MPC8272 Family** | | | PC

MC | 0

A.0 | 0.13 µm

HiP7 | 0K50M

1K50M

Notes:

1\\. The IMMR[16-31] indicates the mask number.

2\\. The Rev_Num located at offset 0x8AF0 in DPRAM indicates the CPM microcode revision number.

3 . Encryption Enabled.

4 . Encryption Disabled.

Masks and versions table last updated on 14OCT2004.

MPC8270CVVQLDA中文资料参数规格
技术参数

频率 333 MHz

电源电压DC 1.50 V

无卤素状态 Halogen Free

针脚数 480

时钟频率 333 MHz

RAM大小 32768 B

位数 32

工作温度Max 105 ℃

工作温度Min -40 ℃

电源电压Max 1.6 V

电源电压Min 1.45 V

封装参数

安装方式 Surface Mount

引脚数 480

封装 LBGA-480

外形尺寸

封装 LBGA-480

物理参数

工作温度 -40℃ ~ 105℃ TA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

海关信息

ECCN代码 3A991.a.2

MPC8270CVVQLDA引脚图与封装图
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型号 制造商 描述 购买
MPC8270CVVQLDA NXP 恩智浦 NXP  MPC8270CVVQLDA  芯片, 微控制器, 32位, POWER, 333MHZ, TBGA-480 搜索库存
替代型号MPC8270CVVQLDA
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: MPC8270CVVQLDA

品牌: NXP 恩智浦

封装: TBGA 1.5V 32Bit 333MHz

当前型号

NXP  MPC8270CVVQLDA  芯片, 微控制器, 32位, POWER, 333MHZ, TBGA-480

当前型号

型号: MPC8270CZUQLDA

品牌: 恩智浦

封装: TBGA-480

完全替代

PowerPC系列 333MHz

MPC8270CVVQLDA和MPC8270CZUQLDA的区别

型号: MPC8280CVVUPEA

品牌: 恩智浦

封装: TBGA 450MHz 480Pin

类似代替

NXP  MPC8280CVVUPEA  芯片, 微处理器, 32位, 450MHZ, TBGA-480

MPC8270CVVQLDA和MPC8280CVVUPEA的区别

型号: MPC8270CZUUPEA

品牌: 恩智浦

封装: TBGA 1.45V 450MHz

类似代替

NXP  MPC8270CZUUPEA  芯片, 32位微处理器, 450MHz, TBGA-480

MPC8270CVVQLDA和MPC8270CZUUPEA的区别