0444321403
数据手册.pdfMolex(莫仕)
连接器
3.00毫米（ 0.118 “ ）间距微飞度3.0 BMI ™接头，表面安装，双排，垂直，与PCB偏光PEG， 14电路， 0.76μm （ 30μ ”），金（Au ）选择性电镀 3.00mm .118" Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, 0.76μm 30μ" Gold Au Selective Plating
Connector Header Through Hole 14 position 0.118" 3.00mm
得捷:
CONN HEADER VERT 14POS 3MM
安富利:
Conn Wire to Board HDR 14 POS 3mm Solder ST Thru-Hole Tray