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XC3S200AN-4FTG256I

XC3S200AN-4FTG256I

数据手册.pdf
Xilinx(赛灵思) 主动器件

XILINX  XC3S200AN-4FTG256I  可编程逻辑芯片, FPGA, SPARTAN-3AN, 200K门, 256FTBG

The is a Spartan®-3AN FPGA combines the best attributes of a leading edge, FPGA with non-volatile technology across a broad range of densities. The family combines all the features of the Spartan®-3A FPGA family plus leading technology in-system Flash memory for configuration and non-volatile data storage. It is a part of the extended Spartan-3A family, which also includes the Spartan®-3A FPGA and the higher density Spartan®-3A DSP FPGA. Combining FPGA and Flash technology minimizes chip count, PCB traces and overall size while increasing system reliability. The FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. It is the world"s first non-volatile FPGA with MultiBoot, supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes or multiple system configurations.

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Eliminates traditional non-volatile FPGA limitations
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Integrated robust configuration memory
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Plentiful amounts of non-volatile memory available to the user
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Robust 100k Flash memory program/erase cycles
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20 Years Flash memory data retention
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Security features provide bitstream anti-cloning protection
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Configuration watchdog timer automatically recovers from configuration errors
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Suspend mode reduces system power consumption
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Full hot-swap compliance
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Multi-voltage, multi-standard SelectIO™ interface pins
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Abundant, flexible logic resources
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Hierarchical SelectRAM™ memory architecture
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Up to eight Digital Clock Managers DCMs
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Eight global clocks and eight additional clocks per each half of device
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Complete ® ISE® and WebPACK™ software development system support
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MicroBlaze™ and PicoBlaze™ embedded processor cores
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Fully compliant 32/64-bit 33MHz PCI™ technology support
XC3S200AN-4FTG256I中文资料参数规格
技术参数

频率 667 MHz

针脚数 256

RAM大小 36864 B

逻辑门个数 200000

输入/输出数 195 Input

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 1.14V ~ 1.26V

封装参数

安装方式 Surface Mount

引脚数 256

封装 LBGA-256

外形尺寸

封装 LBGA-256

物理参数

工作温度 -40℃ ~ 100℃ TJ

其他

产品生命周期 Active

包装方式 Each

制造应用 车用, 医用, Communications & Networking, 通信与网络, Automotive, 消费电子产品, Consumer Electronics, Medical

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC标准 No SVHC

REACH SVHC版本 2014/06/16

海关信息

香港进出口证 NLR

XC3S200AN-4FTG256I引脚图与封装图
XC3S200AN-4FTG256I引脚图

XC3S200AN-4FTG256I引脚图

XC3S200AN-4FTG256I封装图

XC3S200AN-4FTG256I封装图

XC3S200AN-4FTG256I封装焊盘图

XC3S200AN-4FTG256I封装焊盘图

在线购买XC3S200AN-4FTG256I
型号 制造商 描述 购买
XC3S200AN-4FTG256I Xilinx 赛灵思 XILINX  XC3S200AN-4FTG256I  可编程逻辑芯片, FPGA, SPARTAN-3AN, 200K门, 256FTBG 搜索库存
替代型号XC3S200AN-4FTG256I
图片 型号/品牌/封装 代替类型 描述 替代型号对比

型号: XC3S200AN-4FTG256I

品牌: Xilinx 赛灵思

封装: FTBGA 200000Gate 667MHz

当前型号

XILINX  XC3S200AN-4FTG256I  可编程逻辑芯片, FPGA, SPARTAN-3AN, 200K门, 256FTBG

当前型号

型号: XC3S200A-4FTG256I

品牌: 赛灵思

封装: FTBGA 200000Gate

完全替代

XC3S200A-4FTG256I 磨码

XC3S200AN-4FTG256I和XC3S200A-4FTG256I的区别

型号: XC3S200AN-5FTG256C

品牌: 赛灵思

封装: 256-LBGA

完全替代

XC3S200AN 5FTG256C 磨码

XC3S200AN-4FTG256I和XC3S200AN-5FTG256C的区别

型号: XC3S200A-4FT256I

品牌: 赛灵思

封装: 256-LBGA

完全替代

XC3S200A 4FT256I 磨码

XC3S200AN-4FTG256I和XC3S200A-4FT256I的区别